The manufacture of GaAs wafers entails the cutting and grinding of wafers, with water used as a cooling medium. The resulting wastewater is contaminated with soluble arsenic, and cannot be discharged. Arsenic in trace amounts is also found in groundwater and in process water in industries such as PC Board etching. Safely and cost-effectively disposing of those highly toxic heavy metals is a constant concern for manufacturers in this sector. A reliable, complete solution that deals effectively with this problem had not been found until SolmeteX® developed its unique, targeted metal binding technology.
What's the difference?
The MetallX™ adsorbent is made from non-toxic inorganic mixed metal oxide which contains molecular-sized “cavities” that very selectively bind multivalent anions - components with two or more negative charges. Monovalent anions are not bound to a significant extent.
Multivalent anions are irreversibly incorporated into the plate-like crystal structure of the material. Examples of metals that are thus removed through the use of MetallX™ are arsenic, as arsenate; chromium as chromate; silver and ferrous cyanide.
Benefits of the MetallX™ Arsenic removal systems from SolmeteX®:
- Meet strict arsenic discharge requirements - today and tomorrow
- Save by reusing or discharging process water
- Further savings of up to 80% possible over traditional treatment costs
- Up to 95% reduction on waste hauling amounts
- Waste complies with TLCP and can be safely landfilled
- Compact footprint doesn't require expensive space